DEPOSITION OF THIN TiO2 FILMS BY DC MAGNETRON SPUTTERING METHOD

Sputter deposition process is another old technique being used in modern semiconductor industries. Sputtering is a process that can deposit TiO2 material on wafer/glass substrates. In this process target is connected to negative high voltage. Further argon gas is introduced into the chamber and is ionized to a positive charge. The positively charged argon atoms are attracted and strike the negatively biased target. The sputtered atoms and molecules scatter in the chamber and out of which some comes to rest on the wafer. A principal feature of a sputtering process is that the target material is deposited on the wafer without chemical or compositional change. In the present work, DC sputtering techniques has been used: